CFD modeling of pin shape effects on capillary flow during wave soldering

M. S. Abdul Aziz, M. Z. Abdullah, C. Y. Khor, Azman Jalar @ Jalil, F. Che Ani

Research output: Contribution to journalArticle

21 Citations (Scopus)

Abstract

This paper presents an effective numerical method for evaluating the effect of the pin-through-hole (PTH) shape on the soldering stage using wave soldering technique. Three-dimensional finite volume numerical approach was employed to investigate capillary flow behavior when the PTH component with different pin shapes passes through molten solder (63Sn37Pb). An experiment was carried out on a single circular pin and compared with FLUENT simulation. Various PTH shapes, such as circle, triangle, square, rectangle, and hexagon, were modeled and meshed using computational fluid dynamics pre-processing software GAMBIT. The solder melt front was tracked using the volume of the fluid model. Using the circular PTH pin yielded the fastest front advancement during soldering, whereas the angle-edged PTH component increased the filling time and resulted in an uneven profile. Solder profile prediction was substantiated by experimental results. The current simulation results are expected to provide a better understanding of capillary action in various PTH geometrical shapes during wave soldering.

Original languageEnglish
Pages (from-to)400-410
Number of pages11
JournalInternational Journal of Heat and Mass Transfer
Volume72
DOIs
Publication statusPublished - May 2014

Fingerprint

capillary flow
Capillary flow
soldering
Soldering
charge flow devices
Computational fluid dynamics
Soldering alloys
solders
Molten materials
Numerical methods
Fluids
Processing
rectangles
hexagons
preprocessing
profiles
computational fluid dynamics
triangles
Experiments
simulation

Keywords

  • Capillary flow
  • Computational fluid dynamics
  • Volume of fluid
  • Wave soldering

ASJC Scopus subject areas

  • Mechanical Engineering
  • Condensed Matter Physics
  • Fluid Flow and Transfer Processes

Cite this

CFD modeling of pin shape effects on capillary flow during wave soldering. / Abdul Aziz, M. S.; Abdullah, M. Z.; Khor, C. Y.; Jalar @ Jalil, Azman; Che Ani, F.

In: International Journal of Heat and Mass Transfer, Vol. 72, 05.2014, p. 400-410.

Research output: Contribution to journalArticle

Abdul Aziz, M. S. ; Abdullah, M. Z. ; Khor, C. Y. ; Jalar @ Jalil, Azman ; Che Ani, F. / CFD modeling of pin shape effects on capillary flow during wave soldering. In: International Journal of Heat and Mass Transfer. 2014 ; Vol. 72. pp. 400-410.
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