Abstract
The evaluation of the strength and bondability of gold, Au ball bond requires a new approach to provide a more detail data. Nanoindentation test was used as a new approach to evaluate the strength distribution and bondability of Au ball. Au ball bonds that experienced different value of wire bonding parameter namely bonding force, bonding time, bonding power, and stage temperature were used as samples for the present analysis. The distribution of strength based on hardness and reduced modulus values located at the bonding area of Au ball bonds were found to be related with the values of the wire bonding parameter. Nanoindentation test was found to be a suitable approach to analyze and evaluate the bondability of Au ball bond in a localized and detailed manner. In addition, the responsible mechanism for the thermosonic Au wire bonding can be identified and analyzed by using the results obtained from the nanoindentation test.
| Original language | English |
|---|---|
| Pages (from-to) | 132-141 |
| Number of pages | 10 |
| Journal | Key Engineering Materials |
| Volume | 700 |
| DOIs | |
| Publication status | Published - 2016 |
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Keywords
- Bondability
- Bonding mechanisms
- Nanoindentation
- Wire bonding
ASJC Scopus subject areas
- Materials Science(all)
- Mechanics of Materials
- Mechanical Engineering
Cite this
Bondability and strength evaluation of gold ball bond using nanoindentation approach. / Zulkifli, Muhammad Nubli; Jalar @ Jalil, Azman; Abdullah, Shahrum; Othman, Norinsan Kamil.
In: Key Engineering Materials, Vol. 700, 2016, p. 132-141.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Bondability and strength evaluation of gold ball bond using nanoindentation approach
AU - Zulkifli, Muhammad Nubli
AU - Jalar @ Jalil, Azman
AU - Abdullah, Shahrum
AU - Othman, Norinsan Kamil
PY - 2016
Y1 - 2016
N2 - The evaluation of the strength and bondability of gold, Au ball bond requires a new approach to provide a more detail data. Nanoindentation test was used as a new approach to evaluate the strength distribution and bondability of Au ball. Au ball bonds that experienced different value of wire bonding parameter namely bonding force, bonding time, bonding power, and stage temperature were used as samples for the present analysis. The distribution of strength based on hardness and reduced modulus values located at the bonding area of Au ball bonds were found to be related with the values of the wire bonding parameter. Nanoindentation test was found to be a suitable approach to analyze and evaluate the bondability of Au ball bond in a localized and detailed manner. In addition, the responsible mechanism for the thermosonic Au wire bonding can be identified and analyzed by using the results obtained from the nanoindentation test.
AB - The evaluation of the strength and bondability of gold, Au ball bond requires a new approach to provide a more detail data. Nanoindentation test was used as a new approach to evaluate the strength distribution and bondability of Au ball. Au ball bonds that experienced different value of wire bonding parameter namely bonding force, bonding time, bonding power, and stage temperature were used as samples for the present analysis. The distribution of strength based on hardness and reduced modulus values located at the bonding area of Au ball bonds were found to be related with the values of the wire bonding parameter. Nanoindentation test was found to be a suitable approach to analyze and evaluate the bondability of Au ball bond in a localized and detailed manner. In addition, the responsible mechanism for the thermosonic Au wire bonding can be identified and analyzed by using the results obtained from the nanoindentation test.
KW - Bondability
KW - Bonding mechanisms
KW - Nanoindentation
KW - Wire bonding
UR - http://www.scopus.com/inward/record.url?scp=84978731512&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84978731512&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/KEM.700.132
DO - 10.4028/www.scientific.net/KEM.700.132
M3 - Article
VL - 700
SP - 132
EP - 141
JO - Key Engineering Materials
JF - Key Engineering Materials
SN - 1013-9826
ER -