Bondability and strength evaluation of gold ball bond using nanoindentation approach

Research output: Contribution to journalArticle

Abstract

The evaluation of the strength and bondability of gold, Au ball bond requires a new approach to provide a more detail data. Nanoindentation test was used as a new approach to evaluate the strength distribution and bondability of Au ball. Au ball bonds that experienced different value of wire bonding parameter namely bonding force, bonding time, bonding power, and stage temperature were used as samples for the present analysis. The distribution of strength based on hardness and reduced modulus values located at the bonding area of Au ball bonds were found to be related with the values of the wire bonding parameter. Nanoindentation test was found to be a suitable approach to analyze and evaluate the bondability of Au ball bond in a localized and detailed manner. In addition, the responsible mechanism for the thermosonic Au wire bonding can be identified and analyzed by using the results obtained from the nanoindentation test.

Original languageEnglish
Pages (from-to)132-141
Number of pages10
JournalKey Engineering Materials
Volume700
DOIs
Publication statusPublished - 2016

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Nanoindentation
Gold
Wire
Hardness

Keywords

  • Bondability
  • Bonding mechanisms
  • Nanoindentation
  • Wire bonding

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

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title = "Bondability and strength evaluation of gold ball bond using nanoindentation approach",
abstract = "The evaluation of the strength and bondability of gold, Au ball bond requires a new approach to provide a more detail data. Nanoindentation test was used as a new approach to evaluate the strength distribution and bondability of Au ball. Au ball bonds that experienced different value of wire bonding parameter namely bonding force, bonding time, bonding power, and stage temperature were used as samples for the present analysis. The distribution of strength based on hardness and reduced modulus values located at the bonding area of Au ball bonds were found to be related with the values of the wire bonding parameter. Nanoindentation test was found to be a suitable approach to analyze and evaluate the bondability of Au ball bond in a localized and detailed manner. In addition, the responsible mechanism for the thermosonic Au wire bonding can be identified and analyzed by using the results obtained from the nanoindentation test.",
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