Bending and fatigue characterization on pH hydrofobic encapsulation material

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Nowadays the microsensor is playing the big role our modern life. The Ion Sensitive Field Effect Transistor or Isfet pH sensor is one the said microsensor. The use of microsensors for in-field monitoring of environmental parameters is gaining interest due to their advantages over conventional sensors. The fabrication of isfet pH sensor are using standard transistor process i.e thru semiconductor process, with further advantages such as small size and robustness. The differences between Isfet pH sensor with other electronic Integrated Circuit (IC's) is the encapsulation/package use to protect the membrane/sensitive area. The Isfet pH sensor required an opening at sensing area or membrane area. Thus, it can't follow the standard IC's packaging using the Joint Electron Device Engineering Council (JEDEC) encapsulation which only offers fully enclosure. As of today there is no standard package available for Isfet pH sensor. In this paper, the bending and fatigue test characteristics for hydrophobic materials and roger Printed Circuit Board (PCB) are being presented and one can identified which material contribute to the package strength. The bending test show the maximum pressure able to absorb by the package before failed. The fatigue test shared the info on the cycle required before the package broken.

Original languageEnglish
Title of host publication2017 IEEE Conference on Open Systems, ICOS 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages43-47
Number of pages5
Volume2018-January
ISBN (Electronic)9781538607312
DOIs
Publication statusPublished - 2 Feb 2018
Event2017 IEEE Conference on Open Systems, ICOS 2017 - Miri, Sarawak, Malaysia
Duration: 13 Nov 201714 Nov 2017

Other

Other2017 IEEE Conference on Open Systems, ICOS 2017
CountryMalaysia
CityMiri, Sarawak
Period13/11/1714/11/17

Fingerprint

pH sensors
Encapsulation
Microsensors
Fatigue of materials
Integrated circuits
Ion sensitive field effect transistors
Membranes
Electron devices
Bending tests
Enclosures
Printed circuit boards
Packaging
Transistors
Semiconductor materials
Fabrication
Monitoring
Sensors

Keywords

  • Encapsulation
  • Isfet pH
  • pH Sensor

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Safety, Risk, Reliability and Quality
  • Computer Science Applications

Cite this

Mamat, H., & Jalar @ Jalil, A. (2018). Bending and fatigue characterization on pH hydrofobic encapsulation material. In 2017 IEEE Conference on Open Systems, ICOS 2017 (Vol. 2018-January, pp. 43-47). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICOS.2017.8280272

Bending and fatigue characterization on pH hydrofobic encapsulation material. / Mamat, H.; Jalar @ Jalil, Azman.

2017 IEEE Conference on Open Systems, ICOS 2017. Vol. 2018-January Institute of Electrical and Electronics Engineers Inc., 2018. p. 43-47.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Mamat, H & Jalar @ Jalil, A 2018, Bending and fatigue characterization on pH hydrofobic encapsulation material. in 2017 IEEE Conference on Open Systems, ICOS 2017. vol. 2018-January, Institute of Electrical and Electronics Engineers Inc., pp. 43-47, 2017 IEEE Conference on Open Systems, ICOS 2017, Miri, Sarawak, Malaysia, 13/11/17. https://doi.org/10.1109/ICOS.2017.8280272
Mamat H, Jalar @ Jalil A. Bending and fatigue characterization on pH hydrofobic encapsulation material. In 2017 IEEE Conference on Open Systems, ICOS 2017. Vol. 2018-January. Institute of Electrical and Electronics Engineers Inc. 2018. p. 43-47 https://doi.org/10.1109/ICOS.2017.8280272
Mamat, H. ; Jalar @ Jalil, Azman. / Bending and fatigue characterization on pH hydrofobic encapsulation material. 2017 IEEE Conference on Open Systems, ICOS 2017. Vol. 2018-January Institute of Electrical and Electronics Engineers Inc., 2018. pp. 43-47
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