Appraisal of moisture problem of inheritance building envelope assemblies via visible and infrared thermography methods

Ting Siew Jing, Md Azree Othuman Mydina, Nangkula Utaberta

Research output: Contribution to journalArticle

Abstract

In order to gauge the moisture performance of walls and roofs there is a need to investigate the paths of moisture penetrating into the wall assembly, how long and where the moisture stays, and whether it causes temporary reduction of performance or permanent damage. The non-contact safe nature and usefulness in temperature measurement of infrared thermography have made it a popular instrument for building diagnostics. Hence, this paper depicts a documentation process which makes use of both visible and infrared thermal images to identify moisture anomalies in heritage building envelope assemblies. In sequence to achieve the purpose, visible and infrared thermal images are recorded for comparison and further analysis. It can be concluded that infrared thermal imaging camera is useful for identification of moisture problems in building façade, whereas combination of both visible and infrared thermal imaging methods produces a more advanced, accurate and effective approach for building diagnostics.

Original languageEnglish
Pages (from-to)1-6
Number of pages6
JournalJurnal Teknologi
Volume75
Issue number5
Publication statusPublished - 5 Aug 2015
Externally publishedYes

Fingerprint

Infrared imaging
Moisture
Infrared radiation
Temperature measurement
Roofs
Gages
Cameras
Hot Temperature

Keywords

  • Documentation
  • Heritage buildings
  • Infrared thermography
  • Moisture

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Appraisal of moisture problem of inheritance building envelope assemblies via visible and infrared thermography methods. / Jing, Ting Siew; Othuman Mydina, Md Azree; Utaberta, Nangkula.

In: Jurnal Teknologi, Vol. 75, No. 5, 05.08.2015, p. 1-6.

Research output: Contribution to journalArticle

Jing, Ting Siew ; Othuman Mydina, Md Azree ; Utaberta, Nangkula. / Appraisal of moisture problem of inheritance building envelope assemblies via visible and infrared thermography methods. In: Jurnal Teknologi. 2015 ; Vol. 75, No. 5. pp. 1-6.
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