Analysis of material properties for thin film membrane in thermal actuated micropump

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents a comparison of thin film materials used as movable membrane for thermal actuated micropump. The materials discussed are PMMA, polyimide, silicon nitride (Si 3N 4) and single crystal silicon. The properties of membrane material are characterized using Finite Element Analysis (FEA) to study its mechanical and physical behavior that are suitable to be used as an actuator for thermal micropump. Parameters such as density, elastic modulus, stiffness, Poisson ratio, size, dimension and thickness are studied to find the optimum design for the membrane. From the analysis, it was shown that polyimide has the highest deflection that ranges from 0.13-0.86 m at dimension area of less than 12 mm 2. Polyimide is also the most promising candidate material for the pump membrane due to its elasticity, robustness, simple fabrication and its capability to handle very high temperatures.

Original languageEnglish
Title of host publication2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts
Pages211-214
Number of pages4
DOIs
Publication statusPublished - 2011
Event2011 IEEE Regional Symposium on Micro and Nano Electronics, RSM 2011 - Kota Kinabalu, Sabah
Duration: 28 Sep 201130 Sep 2011

Other

Other2011 IEEE Regional Symposium on Micro and Nano Electronics, RSM 2011
CityKota Kinabalu, Sabah
Period28/9/1130/9/11

Fingerprint

Materials properties
Polyimides
Membranes
Thin films
Poisson ratio
Silicon nitride
Elasticity
Actuators
Elastic moduli
Stiffness
Single crystals
Pumps
Finite element method
Fabrication
Silicon
Hot Temperature
Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Hamid, N. A., Yunas, J., & Yeop Majlis, B. (2011). Analysis of material properties for thin film membrane in thermal actuated micropump. In 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts (pp. 211-214). [6088326] https://doi.org/10.1109/RSM.2011.6088326

Analysis of material properties for thin film membrane in thermal actuated micropump. / Hamid, Norihan Abdul; Yunas, Jumril; Yeop Majlis, Burhanuddin.

2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts. 2011. p. 211-214 6088326.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hamid, NA, Yunas, J & Yeop Majlis, B 2011, Analysis of material properties for thin film membrane in thermal actuated micropump. in 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts., 6088326, pp. 211-214, 2011 IEEE Regional Symposium on Micro and Nano Electronics, RSM 2011, Kota Kinabalu, Sabah, 28/9/11. https://doi.org/10.1109/RSM.2011.6088326
Hamid NA, Yunas J, Yeop Majlis B. Analysis of material properties for thin film membrane in thermal actuated micropump. In 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts. 2011. p. 211-214. 6088326 https://doi.org/10.1109/RSM.2011.6088326
Hamid, Norihan Abdul ; Yunas, Jumril ; Yeop Majlis, Burhanuddin. / Analysis of material properties for thin film membrane in thermal actuated micropump. 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts. 2011. pp. 211-214
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