An optimization of two-steps curing profile to eliminate voids formation in underfill epoxy for HI-CTE flip chip packaging

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

Underfilling is the preferred process to reduce the impact of the thermal stress that results from the mismatch in the coefficient of thermal expansion (CTE) between the silicon chip and the substrate in Flip Chip Packaging. Voids formation in underfill is considered as failure in flip chip manufacturing process. Voids formation possibly caused by several factors such as poor soldering and flux residue during die attach process, voids entrapment due moisture contamination, dispense pattern process and setting up the curing process. This paper presents the optimization of two steps curing profile in order to reduce voids formation in underfill for Hi-CTE Flip Chip Ceramic Ball Grid Array Package (FC-CBGA). A C-Mode Scanning Aqoustic Microscopy (C-SAM) was used to scan the total count of voids after curing process. Statistic analysis was conducted to analyze the suitable curing profile in order to minimize or eliminate the voids formation. It was shown that the two steps curing profile provided solution for void elimination.

Original languageEnglish
Title of host publicationAdvanced Materials Research
Pages23-27
Number of pages5
Volume97-101
DOIs
Publication statusPublished - 2010
Event2009 International Conference on Manufacturing Science and Engineering, ICMSE 2009 - Zhuhai
Duration: 26 Dec 200928 Dec 2009

Publication series

NameAdvanced Materials Research
Volume97-101
ISSN (Print)10226680

Other

Other2009 International Conference on Manufacturing Science and Engineering, ICMSE 2009
CityZhuhai
Period26/12/0928/12/09

Fingerprint

Thermal expansion
Curing
Packaging
Ball grid arrays
Soldering
Thermal stress
Microscopic examination
Contamination
Moisture
Statistics
Fluxes
Scanning
Silicon
Substrates

Keywords

  • FC-CBGA
  • Two steps curing profile
  • Voids formation

ASJC Scopus subject areas

  • Engineering(all)

Cite this

An optimization of two-steps curing profile to eliminate voids formation in underfill epoxy for HI-CTE flip chip packaging. / Kornain, Zainudin; Jalar @ Jalil, Azman; Rasid, Rozaidi; Abdullah, Shahrum.

Advanced Materials Research. Vol. 97-101 2010. p. 23-27 (Advanced Materials Research; Vol. 97-101).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kornain, Z, Jalar @ Jalil, A, Rasid, R & Abdullah, S 2010, An optimization of two-steps curing profile to eliminate voids formation in underfill epoxy for HI-CTE flip chip packaging. in Advanced Materials Research. vol. 97-101, Advanced Materials Research, vol. 97-101, pp. 23-27, 2009 International Conference on Manufacturing Science and Engineering, ICMSE 2009, Zhuhai, 26/12/09. https://doi.org/10.4028/www.scientific.net/AMR.97-101.23
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