An approach on underfill material selection for the low-k Flip Chip Plastic Ball Grid Array (FCPBGA)

Zainudin Kornain, Nowshad Amin, Ang Ye Cheah, Azman Jalar @ Jalil

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The role of underfill is expanding from preserving solder joint reliability to also protecting fragile low-k chip dielectric layers in flip chip packaging. The aim of this study is to pre-evaluate or presume the reliability performance of several commercial underfill materials for the balance protection against four critical area of locations (four factors) such as package warpage, low-k interface layer dielectric (ILD) or underfill/die interface layer, solder bumps and back die edge in Plastic Flip Chip Ball Grid Array (FCPGBA) packages. The distribution of thermal strain and stress of the package, warpage measurement and solder bump fatigue for different commercial underfills have been assessed and compared via a linear and nonlinear visco-plastic finite element analysis (FEA) under accelerated temperature cycling conditions. The data properties of underfills for simulation have been extracted by using Thermal Mechanical Analyzer (TMA) and Dynamic Mechanical Analyzer (DMA). Both experiments were conducted in-house due to consistent test method compared with the data from supplier. The results from FEA were summarized and discussed to characterize the performance of each underfill material. A total of four factors of equal ranking importance have been considered in this underfill pre-selection approach. The position in the ranking is used to predict the most suitable underfill to be selected for good flip chip package reliability.

Original languageEnglish
Title of host publicationProceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
DOIs
Publication statusPublished - 2008
Event2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2008 - Penang, Malaysia
Duration: 4 Nov 20086 Nov 2008

Other

Other2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2008
CountryMalaysia
CityPenang
Period4/11/086/11/08

Fingerprint

Ball grid arrays
Soldering alloys
Plastics
Finite element method
Packaging
Fatigue of materials
Experiments
Temperature
Hot Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering

Cite this

Kornain, Z., Amin, N., Cheah, A. Y., & Jalar @ Jalil, A. (2008). An approach on underfill material selection for the low-k Flip Chip Plastic Ball Grid Array (FCPBGA). In Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium [5507780] https://doi.org/10.1109/IEMT.2008.5507780

An approach on underfill material selection for the low-k Flip Chip Plastic Ball Grid Array (FCPBGA). / Kornain, Zainudin; Amin, Nowshad; Cheah, Ang Ye; Jalar @ Jalil, Azman.

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. 2008. 5507780.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kornain, Z, Amin, N, Cheah, AY & Jalar @ Jalil, A 2008, An approach on underfill material selection for the low-k Flip Chip Plastic Ball Grid Array (FCPBGA). in Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium., 5507780, 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2008, Penang, Malaysia, 4/11/08. https://doi.org/10.1109/IEMT.2008.5507780
Kornain Z, Amin N, Cheah AY, Jalar @ Jalil A. An approach on underfill material selection for the low-k Flip Chip Plastic Ball Grid Array (FCPBGA). In Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. 2008. 5507780 https://doi.org/10.1109/IEMT.2008.5507780
Kornain, Zainudin ; Amin, Nowshad ; Cheah, Ang Ye ; Jalar @ Jalil, Azman. / An approach on underfill material selection for the low-k Flip Chip Plastic Ball Grid Array (FCPBGA). Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. 2008.
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