Alternative double pass dicing method for thin wafer laminated with die attach film

Hoh Huey Jiun, Ibrahim Ahmad, Azman Jalar @ Jalil, Ghazali Omar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This paper introduces an alternative dicing method to reduce lateral crack and chipping problem in dicing 100pm thickness wafer laminated with die attach film (DAF). Conventional single pass saw process caused lateral crack due to excessive over loading of the epoxy on the blade. To overcome this problem, an alternative method of double pass saw process was proposed to reduce the blade loading. A set of experiments was carried outto determine the saw depth of the first and second pass. Chipping and cracks were characterized using measuring scope and observed with scanning electron microscopy (SEM). Results have shown that the method is more effective and able to reduce almost 80% of the chip/lateral crack as compared to single pass process.

Original languageEnglish
Title of host publicationProceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics
Pages636-641
Number of pages6
Publication statusPublished - 2004
Event2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004 - Kuala Lumpur
Duration: 4 Dec 20049 Dec 2004

Other

Other2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004
CityKuala Lumpur
Period4/12/049/12/04

Fingerprint

Cracks
Scanning electron microscopy
Experiments

Keywords

  • Dual pass saw process
  • Laminated die attach film
  • Lateral crack
  • Stack die

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Jiun, H. H., Ahmad, I., Jalar @ Jalil, A., & Omar, G. (2004). Alternative double pass dicing method for thin wafer laminated with die attach film. In Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics (pp. 636-641). [1620967]

Alternative double pass dicing method for thin wafer laminated with die attach film. / Jiun, Hoh Huey; Ahmad, Ibrahim; Jalar @ Jalil, Azman; Omar, Ghazali.

Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics. 2004. p. 636-641 1620967.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Jiun, HH, Ahmad, I, Jalar @ Jalil, A & Omar, G 2004, Alternative double pass dicing method for thin wafer laminated with die attach film. in Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics., 1620967, pp. 636-641, 2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004, Kuala Lumpur, 4/12/04.
Jiun HH, Ahmad I, Jalar @ Jalil A, Omar G. Alternative double pass dicing method for thin wafer laminated with die attach film. In Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics. 2004. p. 636-641. 1620967
Jiun, Hoh Huey ; Ahmad, Ibrahim ; Jalar @ Jalil, Azman ; Omar, Ghazali. / Alternative double pass dicing method for thin wafer laminated with die attach film. Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics. 2004. pp. 636-641
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