Adsorption mechanism of some chemical amines inhibitors for corrosion inhibition of copper-nickel alloy in hydrochloric acid

Anees A. Khadom, Aprael S. Yaro, Abdul Amir H. Kadhum

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1 Citation (Scopus)

Abstract

The inhibition of copper corrosion by Naphthylamine (NA), Ethylenediamine (EDA), Tetraethylenepentamine (TEPA), Diethylenetriamine (DETA), and Phenylenediamine (PDA) in 5% HCl have been investigated by weight loss technique at different temperatures. Langmuir adsorption isotherm, Freundlich Adsorption Isotherm and Kinetic-Thermodynamic Model were used to describe the adsorption process depending on values of surface converge. Maximum value of surface converge was 0.856 for NA at 35 °C and 15 g/l inhibitor concentration, while the lower value was 0.01 for PDA at 55 °C and 1 g/l inhibitor concentration. The films formed on the copper-nickel alloy surface of NA, EDA, TEPA, and DETA appear to obey the Freundlich Adsorption Isotherm more than Langmuir adsorption isotherm. In the other hand, the two-adsorption isotherms were unsuitable to represent the data of PDA. Results also showed that the Kinetic-Thermodynamic Model was suitable to fit the experimental data of the most inhibitors of the present study.

Original languageEnglish
JournalJournal of Corrosion Science and Engineering
Volume12
Publication statusPublished - 2009

Fingerprint

Hydrochloric Acid
Copper alloys
Nickel alloys
Corrosion inhibitors
Hydrochloric acid
Adsorption isotherms
ethylenediamine
Amines
Phenylenediamines
Corrosion
Adsorption
Thermodynamics
Copper corrosion
Kinetics
nickel copper alloy
Temperature
diethylenetriamine
tetraethylenepentamine

Keywords

  • Adsorption isotherms
  • Copper-nickel alloy
  • Corrosion inhibition
  • Organic inhibitors

ASJC Scopus subject areas

  • Materials Chemistry
  • Metals and Alloys
  • Surfaces, Coatings and Films

Cite this

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title = "Adsorption mechanism of some chemical amines inhibitors for corrosion inhibition of copper-nickel alloy in hydrochloric acid",
abstract = "The inhibition of copper corrosion by Naphthylamine (NA), Ethylenediamine (EDA), Tetraethylenepentamine (TEPA), Diethylenetriamine (DETA), and Phenylenediamine (PDA) in 5{\%} HCl have been investigated by weight loss technique at different temperatures. Langmuir adsorption isotherm, Freundlich Adsorption Isotherm and Kinetic-Thermodynamic Model were used to describe the adsorption process depending on values of surface converge. Maximum value of surface converge was 0.856 for NA at 35 °C and 15 g/l inhibitor concentration, while the lower value was 0.01 for PDA at 55 °C and 1 g/l inhibitor concentration. The films formed on the copper-nickel alloy surface of NA, EDA, TEPA, and DETA appear to obey the Freundlich Adsorption Isotherm more than Langmuir adsorption isotherm. In the other hand, the two-adsorption isotherms were unsuitable to represent the data of PDA. Results also showed that the Kinetic-Thermodynamic Model was suitable to fit the experimental data of the most inhibitors of the present study.",
keywords = "Adsorption isotherms, Copper-nickel alloy, Corrosion inhibition, Organic inhibitors",
author = "Khadom, {Anees A.} and Yaro, {Aprael S.} and Kadhum, {Abdul Amir H.}",
year = "2009",
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T1 - Adsorption mechanism of some chemical amines inhibitors for corrosion inhibition of copper-nickel alloy in hydrochloric acid

AU - Khadom, Anees A.

AU - Yaro, Aprael S.

AU - Kadhum, Abdul Amir H.

PY - 2009

Y1 - 2009

N2 - The inhibition of copper corrosion by Naphthylamine (NA), Ethylenediamine (EDA), Tetraethylenepentamine (TEPA), Diethylenetriamine (DETA), and Phenylenediamine (PDA) in 5% HCl have been investigated by weight loss technique at different temperatures. Langmuir adsorption isotherm, Freundlich Adsorption Isotherm and Kinetic-Thermodynamic Model were used to describe the adsorption process depending on values of surface converge. Maximum value of surface converge was 0.856 for NA at 35 °C and 15 g/l inhibitor concentration, while the lower value was 0.01 for PDA at 55 °C and 1 g/l inhibitor concentration. The films formed on the copper-nickel alloy surface of NA, EDA, TEPA, and DETA appear to obey the Freundlich Adsorption Isotherm more than Langmuir adsorption isotherm. In the other hand, the two-adsorption isotherms were unsuitable to represent the data of PDA. Results also showed that the Kinetic-Thermodynamic Model was suitable to fit the experimental data of the most inhibitors of the present study.

AB - The inhibition of copper corrosion by Naphthylamine (NA), Ethylenediamine (EDA), Tetraethylenepentamine (TEPA), Diethylenetriamine (DETA), and Phenylenediamine (PDA) in 5% HCl have been investigated by weight loss technique at different temperatures. Langmuir adsorption isotherm, Freundlich Adsorption Isotherm and Kinetic-Thermodynamic Model were used to describe the adsorption process depending on values of surface converge. Maximum value of surface converge was 0.856 for NA at 35 °C and 15 g/l inhibitor concentration, while the lower value was 0.01 for PDA at 55 °C and 1 g/l inhibitor concentration. The films formed on the copper-nickel alloy surface of NA, EDA, TEPA, and DETA appear to obey the Freundlich Adsorption Isotherm more than Langmuir adsorption isotherm. In the other hand, the two-adsorption isotherms were unsuitable to represent the data of PDA. Results also showed that the Kinetic-Thermodynamic Model was suitable to fit the experimental data of the most inhibitors of the present study.

KW - Adsorption isotherms

KW - Copper-nickel alloy

KW - Corrosion inhibition

KW - Organic inhibitors

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