Adsorbed CO at polycrystalline copper in phosphate buffered solution

Research output: Contribution to journalArticle

Abstract

The adsorption of CO at polycrystalline copper surface was investigated spectroscopically. It was found that CO adsorbed as a linear adsorbed CO, Cu-COL and was a dominant species on copper surface at low CO concentration. A Cu-COL was electrochemically converted to a bridge bonded CO, Cu-COB at a high CO concentration condition. Increasing the CO surface coverage, θco will increase the formation of adsorbed bridge bonded CO. nitrogen gas purging treatment was used to examine the stability of an adsorbed CO through the evacuation process. The result showed that Cu-COB remained intact while Cu-COL, was completely removed from the copper surface. It suggests that Cu-COL, may involve in a weak bonding to a copper surface such as in a physisorbed interaction, while Cu-CoB, consists much stronger bonding such as a chemisorbed interaction. The N2 purging treatment also gave an additional prove that Cu-COB, was partly converted to Cu(I)-CO at anodic potential regions.

Original languageEnglish
Pages (from-to)27-32
Number of pages6
JournalSains Malaysiana
Volume36
Issue number1
Publication statusPublished - Jul 2007

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Carbon Monoxide
Copper
Phosphates
Purging
Nitrogen
Gases
Adsorption

Keywords

  • Adsorbed carbon monoxide
  • Copper surface

ASJC Scopus subject areas

  • General

Cite this

Adsorbed CO at polycrystalline copper in phosphate buffered solution. / Salimon, Jumat.

In: Sains Malaysiana, Vol. 36, No. 1, 07.2007, p. 27-32.

Research output: Contribution to journalArticle

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AB - The adsorption of CO at polycrystalline copper surface was investigated spectroscopically. It was found that CO adsorbed as a linear adsorbed CO, Cu-COL and was a dominant species on copper surface at low CO concentration. A Cu-COL was electrochemically converted to a bridge bonded CO, Cu-COB at a high CO concentration condition. Increasing the CO surface coverage, θco will increase the formation of adsorbed bridge bonded CO. nitrogen gas purging treatment was used to examine the stability of an adsorbed CO through the evacuation process. The result showed that Cu-COB remained intact while Cu-COL, was completely removed from the copper surface. It suggests that Cu-COL, may involve in a weak bonding to a copper surface such as in a physisorbed interaction, while Cu-CoB, consists much stronger bonding such as a chemisorbed interaction. The N2 purging treatment also gave an additional prove that Cu-COB, was partly converted to Cu(I)-CO at anodic potential regions.

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