A review on solder reflow and flux application for flip chip

Sarveshvaran Suppiah, Nestor Rubio Ong, Zaliman Sauli, Karunavani Sarukunaselan, Jesselyn Barro Alcain, P. Susthitha Menon N V Visvanathan, Vithyacharan Retnasamy

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper encompassed of the evolution and key findings, critical technical challenges, solutions and bonding equipment of solder reflow in flip chip bonding. Upon scrutinizing researches done by others, it can be deduced that peak temperature, time above liquidus, soak temperature, soak time, cooling rate and reflow environment played a vital role in achieving the desired bonding profile. In addition, flux is also needed with the purpose of removing oxides/contaminations on bump surface as well as to promote wetting of solder balls. Electromigration and warpage are the two main challenges faced by solder reflow process which can be overcome by the advancement in under bump metallization (UBM) and substrate technology. The review is ended with a brief description of the current equipment used in solder reflow process.

Original languageEnglish
Title of host publication3rd Electronic and Green Materials International Conference 2017, EGM 2017
PublisherAmerican Institute of Physics Inc.
Volume1885
ISBN (Electronic)9780735415652
DOIs
Publication statusPublished - 26 Sep 2017
Event3rd Electronic and Green Materials International Conference 2017, EGM 2017 - Aonang Krabi, Thailand
Duration: 29 Apr 201730 Apr 2017

Other

Other3rd Electronic and Green Materials International Conference 2017, EGM 2017
CountryThailand
CityAonang Krabi
Period29/4/1730/4/17

Fingerprint

solders
chips
warpage
electromigration
liquidus
wetting
balls
contamination
cooling
temperature
oxides
profiles

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Cite this

Suppiah, S., Ong, N. R., Sauli, Z., Sarukunaselan, K., Alcain, J. B., N V Visvanathan, P. S. M., & Retnasamy, V. (2017). A review on solder reflow and flux application for flip chip. In 3rd Electronic and Green Materials International Conference 2017, EGM 2017 (Vol. 1885). [020264] American Institute of Physics Inc.. https://doi.org/10.1063/1.5002458

A review on solder reflow and flux application for flip chip. / Suppiah, Sarveshvaran; Ong, Nestor Rubio; Sauli, Zaliman; Sarukunaselan, Karunavani; Alcain, Jesselyn Barro; N V Visvanathan, P. Susthitha Menon; Retnasamy, Vithyacharan.

3rd Electronic and Green Materials International Conference 2017, EGM 2017. Vol. 1885 American Institute of Physics Inc., 2017. 020264.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Suppiah, S, Ong, NR, Sauli, Z, Sarukunaselan, K, Alcain, JB, N V Visvanathan, PSM & Retnasamy, V 2017, A review on solder reflow and flux application for flip chip. in 3rd Electronic and Green Materials International Conference 2017, EGM 2017. vol. 1885, 020264, American Institute of Physics Inc., 3rd Electronic and Green Materials International Conference 2017, EGM 2017, Aonang Krabi, Thailand, 29/4/17. https://doi.org/10.1063/1.5002458
Suppiah S, Ong NR, Sauli Z, Sarukunaselan K, Alcain JB, N V Visvanathan PSM et al. A review on solder reflow and flux application for flip chip. In 3rd Electronic and Green Materials International Conference 2017, EGM 2017. Vol. 1885. American Institute of Physics Inc. 2017. 020264 https://doi.org/10.1063/1.5002458
Suppiah, Sarveshvaran ; Ong, Nestor Rubio ; Sauli, Zaliman ; Sarukunaselan, Karunavani ; Alcain, Jesselyn Barro ; N V Visvanathan, P. Susthitha Menon ; Retnasamy, Vithyacharan. / A review on solder reflow and flux application for flip chip. 3rd Electronic and Green Materials International Conference 2017, EGM 2017. Vol. 1885 American Institute of Physics Inc., 2017.
@inproceedings{a8fc6164f27d4984b9b808cd5657fc49,
title = "A review on solder reflow and flux application for flip chip",
abstract = "This paper encompassed of the evolution and key findings, critical technical challenges, solutions and bonding equipment of solder reflow in flip chip bonding. Upon scrutinizing researches done by others, it can be deduced that peak temperature, time above liquidus, soak temperature, soak time, cooling rate and reflow environment played a vital role in achieving the desired bonding profile. In addition, flux is also needed with the purpose of removing oxides/contaminations on bump surface as well as to promote wetting of solder balls. Electromigration and warpage are the two main challenges faced by solder reflow process which can be overcome by the advancement in under bump metallization (UBM) and substrate technology. The review is ended with a brief description of the current equipment used in solder reflow process.",
author = "Sarveshvaran Suppiah and Ong, {Nestor Rubio} and Zaliman Sauli and Karunavani Sarukunaselan and Alcain, {Jesselyn Barro} and {N V Visvanathan}, {P. Susthitha Menon} and Vithyacharan Retnasamy",
year = "2017",
month = "9",
day = "26",
doi = "10.1063/1.5002458",
language = "English",
volume = "1885",
booktitle = "3rd Electronic and Green Materials International Conference 2017, EGM 2017",
publisher = "American Institute of Physics Inc.",

}

TY - GEN

T1 - A review on solder reflow and flux application for flip chip

AU - Suppiah, Sarveshvaran

AU - Ong, Nestor Rubio

AU - Sauli, Zaliman

AU - Sarukunaselan, Karunavani

AU - Alcain, Jesselyn Barro

AU - N V Visvanathan, P. Susthitha Menon

AU - Retnasamy, Vithyacharan

PY - 2017/9/26

Y1 - 2017/9/26

N2 - This paper encompassed of the evolution and key findings, critical technical challenges, solutions and bonding equipment of solder reflow in flip chip bonding. Upon scrutinizing researches done by others, it can be deduced that peak temperature, time above liquidus, soak temperature, soak time, cooling rate and reflow environment played a vital role in achieving the desired bonding profile. In addition, flux is also needed with the purpose of removing oxides/contaminations on bump surface as well as to promote wetting of solder balls. Electromigration and warpage are the two main challenges faced by solder reflow process which can be overcome by the advancement in under bump metallization (UBM) and substrate technology. The review is ended with a brief description of the current equipment used in solder reflow process.

AB - This paper encompassed of the evolution and key findings, critical technical challenges, solutions and bonding equipment of solder reflow in flip chip bonding. Upon scrutinizing researches done by others, it can be deduced that peak temperature, time above liquidus, soak temperature, soak time, cooling rate and reflow environment played a vital role in achieving the desired bonding profile. In addition, flux is also needed with the purpose of removing oxides/contaminations on bump surface as well as to promote wetting of solder balls. Electromigration and warpage are the two main challenges faced by solder reflow process which can be overcome by the advancement in under bump metallization (UBM) and substrate technology. The review is ended with a brief description of the current equipment used in solder reflow process.

UR - http://www.scopus.com/inward/record.url?scp=85030665408&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85030665408&partnerID=8YFLogxK

U2 - 10.1063/1.5002458

DO - 10.1063/1.5002458

M3 - Conference contribution

VL - 1885

BT - 3rd Electronic and Green Materials International Conference 2017, EGM 2017

PB - American Institute of Physics Inc.

ER -