A practical investigation on the root causes of the mechanical damages of pogo pin type test sockets to IC packages in final test

Nowshad Amin, Lam Zi Yi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

Abstract

The root causes of the mechanical limitations are analyzed and their damages to the device-under-test (DUT) lead are demonstrated in this study. The evolution of microelectronics toward more densely packed contacts in a much smaller foot print has set a higher standard for the test socket used in the final test. This trend of evolution has brought several mechanical challenges for the pogo pin test socket, such as, (a) inability to overcome the trade off of the witness marks and contact resistance, (b) difficulties to target a specific contact area on a solder ball/unit leads when the pitches become too fine (c) difficulties in tolerance control as the pitch drops below 1.016mm and (d) smaller metal contacts have lower fatigue life. All such problems are discussed here based on some experimental observations.

Original languageEnglish
Title of host publicationIEEE International Conference on Semiconductor Electronics, Proceedings, ICSE
Pages373-397
Number of pages25
DOIs
Publication statusPublished - 2008
Event2008 IEEE International Conference on Semiconductor Electronics, ICSE 2008 - Johor Bahru, Johor
Duration: 25 Nov 200827 Nov 2008

Other

Other2008 IEEE International Conference on Semiconductor Electronics, ICSE 2008
CityJohor Bahru, Johor
Period25/11/0827/11/08

Fingerprint

Contact resistance
Microelectronics
Soldering alloys
Lead
Metals
Fatigue of materials

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Amin, N., & Yi, L. Z. (2008). A practical investigation on the root causes of the mechanical damages of pogo pin type test sockets to IC packages in final test. In IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE (pp. 373-397). [4770348] https://doi.org/10.1109/SMELEC.2008.4770348

A practical investigation on the root causes of the mechanical damages of pogo pin type test sockets to IC packages in final test. / Amin, Nowshad; Yi, Lam Zi.

IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. 2008. p. 373-397 4770348.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Amin, N & Yi, LZ 2008, A practical investigation on the root causes of the mechanical damages of pogo pin type test sockets to IC packages in final test. in IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE., 4770348, pp. 373-397, 2008 IEEE International Conference on Semiconductor Electronics, ICSE 2008, Johor Bahru, Johor, 25/11/08. https://doi.org/10.1109/SMELEC.2008.4770348
Amin N, Yi LZ. A practical investigation on the root causes of the mechanical damages of pogo pin type test sockets to IC packages in final test. In IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. 2008. p. 373-397. 4770348 https://doi.org/10.1109/SMELEC.2008.4770348
Amin, Nowshad ; Yi, Lam Zi. / A practical investigation on the root causes of the mechanical damages of pogo pin type test sockets to IC packages in final test. IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. 2008. pp. 373-397
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