A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis

M. Mazlan, A. Rahim, A. M. Mustafa Al Bakri, M. A. Iqbal, W. Razak, M. S. Salim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

Thermal pad is new technology in the world that been used in PLCC in order to reduce junction temperature to the minimum level in electronic components. Thermal Pad was made by using nano-silver as main material. Nano-silver silica films were applied on PLCC using a sol-gel process and heat-treated at different temperatures. In electronic industry, the electronic components that exceed 70°C will malfunction and damage due to the overheated. The design is used nano-silver as main material in thermo pad because it has high value of thermal conductivity and enables to dissipate heat very efficiently. The advantages of this product are enables to reduce junction temperature of PLCC 20-30%. It also had constant thickness in order to get accurate results. It was a new technology that been applied in electronic industry in order to reduce the temperature of the electronic components.

Original languageEnglish
Title of host publicationAdvanced Materials Research
Pages158-163
Number of pages6
Volume795
DOIs
Publication statusPublished - 2013
Externally publishedYes
Event2nd International Conference on Sustainable Materials, ICoSM 2013 - Penang
Duration: 26 Mar 201327 Mar 2013

Publication series

NameAdvanced Materials Research
Volume795
ISSN (Print)10226680

Other

Other2nd International Conference on Sustainable Materials, ICoSM 2013
CityPenang
Period26/3/1327/3/13

Fingerprint

Patents and inventions
Sol-gels
Computational fluid dynamics
Silver
Silica
Plastics
Electronics industry
Temperature
Sol-gel process
Thermal conductivity
Hot Temperature

Keywords

  • Nano-Silver
  • Numerical simulation
  • PLCC package
  • Thermal pad

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Mazlan, M., Rahim, A., Mustafa Al Bakri, A. M., Iqbal, M. A., Razak, W., & Salim, M. S. (2013). A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis. In Advanced Materials Research (Vol. 795, pp. 158-163). (Advanced Materials Research; Vol. 795). https://doi.org/10.4028/www.scientific.net/AMR.795.158

A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis. / Mazlan, M.; Rahim, A.; Mustafa Al Bakri, A. M.; Iqbal, M. A.; Razak, W.; Salim, M. S.

Advanced Materials Research. Vol. 795 2013. p. 158-163 (Advanced Materials Research; Vol. 795).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Mazlan, M, Rahim, A, Mustafa Al Bakri, AM, Iqbal, MA, Razak, W & Salim, MS 2013, A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis. in Advanced Materials Research. vol. 795, Advanced Materials Research, vol. 795, pp. 158-163, 2nd International Conference on Sustainable Materials, ICoSM 2013, Penang, 26/3/13. https://doi.org/10.4028/www.scientific.net/AMR.795.158
Mazlan M, Rahim A, Mustafa Al Bakri AM, Iqbal MA, Razak W, Salim MS. A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis. In Advanced Materials Research. Vol. 795. 2013. p. 158-163. (Advanced Materials Research). https://doi.org/10.4028/www.scientific.net/AMR.795.158
Mazlan, M. ; Rahim, A. ; Mustafa Al Bakri, A. M. ; Iqbal, M. A. ; Razak, W. ; Salim, M. S. / A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis. Advanced Materials Research. Vol. 795 2013. pp. 158-163 (Advanced Materials Research).
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