A modified lift-off technique to prevent pattern following effect in microfabrication

Mitra Damghanian, Burhanuddin Yeop Majlis

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

A surface micromachining technique is proposed which significantly reduces the undesirable pattern following effect and prevents disturbance in subsequent layers of the structure. This modified lift off method starting from a flat surface embeds the base layer of microstructure in the substrate in order to maintain initial surface profile, and thus allows fabrication of subsequent layers to start from another flat surface. Theoretically, multi layer structures can be fabricated by this technique layer by layer with minimum disturbance caused by pattern following effect. It also eliminates the misalignment error which is a common structure disorder in multilayer structures. The technique is illustrated and used for fabrication of aluminum and copper bias lines on a glass and silicon substrates. An even surface profile with average step height of 10 nm has been achieved. The proposed technique can be extended to other materials with proper adjustments.

Original languageEnglish
Title of host publicationIEEE International Conference on Semiconductor Electronics, Proceedings, ICSE
Pages634-638
Number of pages5
DOIs
Publication statusPublished - 2008
Event2008 IEEE International Conference on Semiconductor Electronics, ICSE 2008 - Johor Bahru, Johor
Duration: 25 Nov 200827 Nov 2008

Other

Other2008 IEEE International Conference on Semiconductor Electronics, ICSE 2008
CityJohor Bahru, Johor
Period25/11/0827/11/08

Fingerprint

Microfabrication
Surface micromachining
Fabrication
Silicon
Substrates
Aluminum
Copper
Multilayers
Glass
Microstructure

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Damghanian, M., & Yeop Majlis, B. (2008). A modified lift-off technique to prevent pattern following effect in microfabrication. In IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE (pp. 634-638). [4770406] https://doi.org/10.1109/SMELEC.2008.4770406

A modified lift-off technique to prevent pattern following effect in microfabrication. / Damghanian, Mitra; Yeop Majlis, Burhanuddin.

IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. 2008. p. 634-638 4770406.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Damghanian, M & Yeop Majlis, B 2008, A modified lift-off technique to prevent pattern following effect in microfabrication. in IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE., 4770406, pp. 634-638, 2008 IEEE International Conference on Semiconductor Electronics, ICSE 2008, Johor Bahru, Johor, 25/11/08. https://doi.org/10.1109/SMELEC.2008.4770406
Damghanian M, Yeop Majlis B. A modified lift-off technique to prevent pattern following effect in microfabrication. In IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. 2008. p. 634-638. 4770406 https://doi.org/10.1109/SMELEC.2008.4770406
Damghanian, Mitra ; Yeop Majlis, Burhanuddin. / A modified lift-off technique to prevent pattern following effect in microfabrication. IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. 2008. pp. 634-638
@inproceedings{40188b1bcb664b63a1411441a95e92ac,
title = "A modified lift-off technique to prevent pattern following effect in microfabrication",
abstract = "A surface micromachining technique is proposed which significantly reduces the undesirable pattern following effect and prevents disturbance in subsequent layers of the structure. This modified lift off method starting from a flat surface embeds the base layer of microstructure in the substrate in order to maintain initial surface profile, and thus allows fabrication of subsequent layers to start from another flat surface. Theoretically, multi layer structures can be fabricated by this technique layer by layer with minimum disturbance caused by pattern following effect. It also eliminates the misalignment error which is a common structure disorder in multilayer structures. The technique is illustrated and used for fabrication of aluminum and copper bias lines on a glass and silicon substrates. An even surface profile with average step height of 10 nm has been achieved. The proposed technique can be extended to other materials with proper adjustments.",
author = "Mitra Damghanian and {Yeop Majlis}, Burhanuddin",
year = "2008",
doi = "10.1109/SMELEC.2008.4770406",
language = "English",
isbn = "9781424425617",
pages = "634--638",
booktitle = "IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE",

}

TY - GEN

T1 - A modified lift-off technique to prevent pattern following effect in microfabrication

AU - Damghanian, Mitra

AU - Yeop Majlis, Burhanuddin

PY - 2008

Y1 - 2008

N2 - A surface micromachining technique is proposed which significantly reduces the undesirable pattern following effect and prevents disturbance in subsequent layers of the structure. This modified lift off method starting from a flat surface embeds the base layer of microstructure in the substrate in order to maintain initial surface profile, and thus allows fabrication of subsequent layers to start from another flat surface. Theoretically, multi layer structures can be fabricated by this technique layer by layer with minimum disturbance caused by pattern following effect. It also eliminates the misalignment error which is a common structure disorder in multilayer structures. The technique is illustrated and used for fabrication of aluminum and copper bias lines on a glass and silicon substrates. An even surface profile with average step height of 10 nm has been achieved. The proposed technique can be extended to other materials with proper adjustments.

AB - A surface micromachining technique is proposed which significantly reduces the undesirable pattern following effect and prevents disturbance in subsequent layers of the structure. This modified lift off method starting from a flat surface embeds the base layer of microstructure in the substrate in order to maintain initial surface profile, and thus allows fabrication of subsequent layers to start from another flat surface. Theoretically, multi layer structures can be fabricated by this technique layer by layer with minimum disturbance caused by pattern following effect. It also eliminates the misalignment error which is a common structure disorder in multilayer structures. The technique is illustrated and used for fabrication of aluminum and copper bias lines on a glass and silicon substrates. An even surface profile with average step height of 10 nm has been achieved. The proposed technique can be extended to other materials with proper adjustments.

UR - http://www.scopus.com/inward/record.url?scp=65949086806&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=65949086806&partnerID=8YFLogxK

U2 - 10.1109/SMELEC.2008.4770406

DO - 10.1109/SMELEC.2008.4770406

M3 - Conference contribution

AN - SCOPUS:65949086806

SN - 9781424425617

SP - 634

EP - 638

BT - IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE

ER -