Abstract
This paper presents the design, simulation and performance evaluation of an area-changed capacitive accelerometer for low-g applications. The movable mass of the accelerometer was designed with many fingers connected in parallel and suspended over stationary electrodes composed of differential comb fingers by means of suspension beams anchored onto the substrate. An area-changed differential capacitance method was used to sense the deflection of the proof mass. A folded suspension design with low spring constant and low cross-axis sensitivity was chosen. The simulation was performed using Coventorware2001.3 software. A 3-mask bulk micromachining wafer bonding fabrication process was utilized to produce this accelerometer. Silicon-on-glass was used to achieve high sensitivity and low mechanical noise while maintaining a simple structure. The general concept, main design considerations, fabrication procedure and performance of the resulted accelerometer was elaborated and presented. A linear relationship between the differential capacitance and acceleration was obtained. The accelerometer sensitivity was calculated to be 0.47pF/g with an acceleration range of ±5g.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of SPIE - The International Society for Optical Engineering |
| Editors | C. Cane, J.-C. Chiao, F.V. Verdu |
| Pages | 675-685 |
| Number of pages | 11 |
| Volume | 5836 |
| DOIs | |
| Publication status | Published - 2005 |
| Event | Smart Sensors, Actuators, and MEMS II - Seville, Spain Duration: 9 May 2005 → 11 May 2005 |
Other
| Other | Smart Sensors, Actuators, and MEMS II |
|---|---|
| Country | Spain |
| City | Seville |
| Period | 9/5/05 → 11/5/05 |
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Keywords
- Accelerometer
- Area-changed
- Bulk micromachined
- Capacitive
- MEMS
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Condensed Matter Physics
Cite this
A low-g bulk micromachined silicon accelerometer with area-changed differential capacitance. / Bais, Badariah; Ahanchian, Ali; Yeop Majlis, Burhanuddin.
Proceedings of SPIE - The International Society for Optical Engineering. ed. / C. Cane; J.-C. Chiao; F.V. Verdu. Vol. 5836 2005. p. 675-685 77.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - A low-g bulk micromachined silicon accelerometer with area-changed differential capacitance
AU - Bais, Badariah
AU - Ahanchian, Ali
AU - Yeop Majlis, Burhanuddin
PY - 2005
Y1 - 2005
N2 - This paper presents the design, simulation and performance evaluation of an area-changed capacitive accelerometer for low-g applications. The movable mass of the accelerometer was designed with many fingers connected in parallel and suspended over stationary electrodes composed of differential comb fingers by means of suspension beams anchored onto the substrate. An area-changed differential capacitance method was used to sense the deflection of the proof mass. A folded suspension design with low spring constant and low cross-axis sensitivity was chosen. The simulation was performed using Coventorware2001.3 software. A 3-mask bulk micromachining wafer bonding fabrication process was utilized to produce this accelerometer. Silicon-on-glass was used to achieve high sensitivity and low mechanical noise while maintaining a simple structure. The general concept, main design considerations, fabrication procedure and performance of the resulted accelerometer was elaborated and presented. A linear relationship between the differential capacitance and acceleration was obtained. The accelerometer sensitivity was calculated to be 0.47pF/g with an acceleration range of ±5g.
AB - This paper presents the design, simulation and performance evaluation of an area-changed capacitive accelerometer for low-g applications. The movable mass of the accelerometer was designed with many fingers connected in parallel and suspended over stationary electrodes composed of differential comb fingers by means of suspension beams anchored onto the substrate. An area-changed differential capacitance method was used to sense the deflection of the proof mass. A folded suspension design with low spring constant and low cross-axis sensitivity was chosen. The simulation was performed using Coventorware2001.3 software. A 3-mask bulk micromachining wafer bonding fabrication process was utilized to produce this accelerometer. Silicon-on-glass was used to achieve high sensitivity and low mechanical noise while maintaining a simple structure. The general concept, main design considerations, fabrication procedure and performance of the resulted accelerometer was elaborated and presented. A linear relationship between the differential capacitance and acceleration was obtained. The accelerometer sensitivity was calculated to be 0.47pF/g with an acceleration range of ±5g.
KW - Accelerometer
KW - Area-changed
KW - Bulk micromachined
KW - Capacitive
KW - MEMS
UR - http://www.scopus.com/inward/record.url?scp=28344442177&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=28344442177&partnerID=8YFLogxK
U2 - 10.1117/12.608050
DO - 10.1117/12.608050
M3 - Conference contribution
VL - 5836
SP - 675
EP - 685
BT - Proceedings of SPIE - The International Society for Optical Engineering
A2 - Cane, C.
A2 - Chiao, J.-C.
A2 - Verdu, F.V.
ER -