A low-g bulk micromachined silicon accelerometer with area-changed differential capacitance

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents the design, simulation and performance evaluation of an area-changed capacitive accelerometer for low-g applications. The movable mass of the accelerometer was designed with many fingers connected in parallel and suspended over stationary electrodes composed of differential comb fingers by means of suspension beams anchored onto the substrate. An area-changed differential capacitance method was used to sense the deflection of the proof mass. A folded suspension design with low spring constant and low cross-axis sensitivity was chosen. The simulation was performed using Coventorware2001.3 software. A 3-mask bulk micromachining wafer bonding fabrication process was utilized to produce this accelerometer. Silicon-on-glass was used to achieve high sensitivity and low mechanical noise while maintaining a simple structure. The general concept, main design considerations, fabrication procedure and performance of the resulted accelerometer was elaborated and presented. A linear relationship between the differential capacitance and acceleration was obtained. The accelerometer sensitivity was calculated to be 0.47pF/g with an acceleration range of ±5g.

Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
EditorsC. Cane, J.-C. Chiao, F.V. Verdu
Pages675-685
Number of pages11
Volume5836
DOIs
Publication statusPublished - 2005
EventSmart Sensors, Actuators, and MEMS II - Seville, Spain
Duration: 9 May 200511 May 2005

Other

OtherSmart Sensors, Actuators, and MEMS II
CountrySpain
CitySeville
Period9/5/0511/5/05

Fingerprint

accelerometers
Accelerometers
Capacitance
capacitance
Silicon
silicon
sensitivity
Fabrication
Wafer bonding
fabrication
Micromachining
micromachining
Masks
deflection
masks
simulation
wafers
computer programs
Glass
Electrodes

Keywords

  • Accelerometer
  • Area-changed
  • Bulk micromachined
  • Capacitive
  • MEMS

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Bais, B., Ahanchian, A., & Yeop Majlis, B. (2005). A low-g bulk micromachined silicon accelerometer with area-changed differential capacitance. In C. Cane, J-C. Chiao, & F. V. Verdu (Eds.), Proceedings of SPIE - The International Society for Optical Engineering (Vol. 5836, pp. 675-685). [77] https://doi.org/10.1117/12.608050

A low-g bulk micromachined silicon accelerometer with area-changed differential capacitance. / Bais, Badariah; Ahanchian, Ali; Yeop Majlis, Burhanuddin.

Proceedings of SPIE - The International Society for Optical Engineering. ed. / C. Cane; J.-C. Chiao; F.V. Verdu. Vol. 5836 2005. p. 675-685 77.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Bais, B, Ahanchian, A & Yeop Majlis, B 2005, A low-g bulk micromachined silicon accelerometer with area-changed differential capacitance. in C Cane, J-C Chiao & FV Verdu (eds), Proceedings of SPIE - The International Society for Optical Engineering. vol. 5836, 77, pp. 675-685, Smart Sensors, Actuators, and MEMS II, Seville, Spain, 9/5/05. https://doi.org/10.1117/12.608050
Bais B, Ahanchian A, Yeop Majlis B. A low-g bulk micromachined silicon accelerometer with area-changed differential capacitance. In Cane C, Chiao J-C, Verdu FV, editors, Proceedings of SPIE - The International Society for Optical Engineering. Vol. 5836. 2005. p. 675-685. 77 https://doi.org/10.1117/12.608050
Bais, Badariah ; Ahanchian, Ali ; Yeop Majlis, Burhanuddin. / A low-g bulk micromachined silicon accelerometer with area-changed differential capacitance. Proceedings of SPIE - The International Society for Optical Engineering. editor / C. Cane ; J.-C. Chiao ; F.V. Verdu. Vol. 5836 2005. pp. 675-685
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