A comparative study of the bonding energy in adhesive wafer bonding

F. Forsberg, F. Saharil, T. Haraldsson, N. Roxhed, G. Stemme, W. Van Der Wijngaart, F. Niklaus

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

Adhesion energies are determined for three different polymers currently used in adhesive wafer bonding of silicon wafers. The adhesion energies of the polymer off-stoichiometry thiol-ene-epoxy OSTE+ and the nano-imprint resist mr-I 9150XP are determined. The results are compared to the adhesion energies of wafers bonded with benzocyclobutene, both with and without adhesion promoter. The adhesion energies of the bonds are studied by blister tests, consisting of delaminating silicon lids bonded to silicon dies with etched circular cavities, using compressed nitrogen gas. The critical pressure needed for delamination is converted into an estimate of the bond adhesion energy. The fabrication of test dies and the evaluation method are described in detail. The mean bond energies of OSTE+ were determined to be 2.1 and 20 J m-2 depending on the choice of the epoxy used. A mean bond energy of 1.5 J m-2 was measured for mr-I 9150XP.

Original languageEnglish
Article number085019
JournalJournal of Micromechanics and Microengineering
Volume23
Issue number8
DOIs
Publication statusPublished - Aug 2013
Externally publishedYes

Fingerprint

Wafer bonding
Adhesives
Adhesion
Silicon
Polymers
Silicon wafers
Sulfhydryl Compounds
Delamination
Stoichiometry
Nitrogen
Gases
Fabrication

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering
  • Mechanics of Materials
  • Electronic, Optical and Magnetic Materials

Cite this

Forsberg, F., Saharil, F., Haraldsson, T., Roxhed, N., Stemme, G., Van Der Wijngaart, W., & Niklaus, F. (2013). A comparative study of the bonding energy in adhesive wafer bonding. Journal of Micromechanics and Microengineering, 23(8), [085019]. https://doi.org/10.1088/0960-1317/23/8/085019

A comparative study of the bonding energy in adhesive wafer bonding. / Forsberg, F.; Saharil, F.; Haraldsson, T.; Roxhed, N.; Stemme, G.; Van Der Wijngaart, W.; Niklaus, F.

In: Journal of Micromechanics and Microengineering, Vol. 23, No. 8, 085019, 08.2013.

Research output: Contribution to journalArticle

Forsberg, F, Saharil, F, Haraldsson, T, Roxhed, N, Stemme, G, Van Der Wijngaart, W & Niklaus, F 2013, 'A comparative study of the bonding energy in adhesive wafer bonding', Journal of Micromechanics and Microengineering, vol. 23, no. 8, 085019. https://doi.org/10.1088/0960-1317/23/8/085019
Forsberg F, Saharil F, Haraldsson T, Roxhed N, Stemme G, Van Der Wijngaart W et al. A comparative study of the bonding energy in adhesive wafer bonding. Journal of Micromechanics and Microengineering. 2013 Aug;23(8). 085019. https://doi.org/10.1088/0960-1317/23/8/085019
Forsberg, F. ; Saharil, F. ; Haraldsson, T. ; Roxhed, N. ; Stemme, G. ; Van Der Wijngaart, W. ; Niklaus, F. / A comparative study of the bonding energy in adhesive wafer bonding. In: Journal of Micromechanics and Microengineering. 2013 ; Vol. 23, No. 8.
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