3C-SiC-on-Si based MEMS packaged capacitive pressure sensor operating up to 500 °c and 5 MPa

Noraini Marsi, Burhanuddin Yeop Majlis, Azrul Azlan Hamzah, Hafzaliza Erny Zainal Abidin, Faisal Mohd-Yasin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper reports a packaged MEMS capacitive pressure sensor based 3C-SiC using bulk-micromachining technology that operates on the pressure up to 5.0 MPa and temperature up to 500 °C. The diaphragm employs a single-crystal 3C-SiC thin film that is back-etched from its Si substrate. A photosensitive ProTEK PSB is used as a protection mask layer to reduce the process steps. We compare our results with similar work that also employs a single-crystal 3C-SiC-on-Si capacitive pressure sensor with ceramic package. The MEMS capacitive pressure sensor is employed with 3C-SiC that was performed using hot wall low pressure chemical vapor deposition (LPCVD) reactors at the Queensland Micro and Nanotechnology Center (QMNC), Griffith University. This paper also focuses on comparing those two highest efficiency distributions in MEMS capacitive pressure sensor device to other types of MEMS capacitive pressure sensor. Different temperature, hysteresis and repeatability tests are presented to demonstrate the functionality of the packaged MEMS capacitive pressure sensor. As expected, the output hysteresis has low hysteresis (less than 0.05%) which has inflexibility greater than traditional silicon. By utilizing this low hysteresis was revealed the packaged MEMS capacitive pressure sensor has high repeatability and stability of the sensor.

Original languageEnglish
Title of host publicationRSM 2015 - 2015 IEEE Regional Symposium on Micro and Nano Electronics, Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9781479985500
DOIs
Publication statusPublished - 11 Dec 2015
Event10th IEEE Regional Symposium on Micro and Nano Electronics, RSM 2015 - Kuala Terengganu, Malaysia
Duration: 19 Aug 201521 Aug 2015

Other

Other10th IEEE Regional Symposium on Micro and Nano Electronics, RSM 2015
CountryMalaysia
CityKuala Terengganu
Period19/8/1521/8/15

Fingerprint

Capacitive sensors
Pressure sensors
pressure sensors
microelectromechanical systems
MEMS
Hysteresis
hysteresis
Single crystals
Low pressure chemical vapor deposition
wall pressure
single crystals
Micromachining
diaphragms
Silicon
micromachining
nanotechnology
Diaphragms
Nanotechnology
Masks
masks

Keywords

  • capacitive
  • MEMS
  • repeatability
  • silicon carbide (3C-SiC)
  • thermal hysteresis

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Electrical and Electronic Engineering

Cite this

Marsi, N., Yeop Majlis, B., Hamzah, A. A., Abidin, H. E. Z., & Mohd-Yasin, F. (2015). 3C-SiC-on-Si based MEMS packaged capacitive pressure sensor operating up to 500 °c and 5 MPa. In RSM 2015 - 2015 IEEE Regional Symposium on Micro and Nano Electronics, Proceedings [7354962] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/RSM.2015.7354962

3C-SiC-on-Si based MEMS packaged capacitive pressure sensor operating up to 500 °c and 5 MPa. / Marsi, Noraini; Yeop Majlis, Burhanuddin; Hamzah, Azrul Azlan; Abidin, Hafzaliza Erny Zainal; Mohd-Yasin, Faisal.

RSM 2015 - 2015 IEEE Regional Symposium on Micro and Nano Electronics, Proceedings. Institute of Electrical and Electronics Engineers Inc., 2015. 7354962.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Marsi, N, Yeop Majlis, B, Hamzah, AA, Abidin, HEZ & Mohd-Yasin, F 2015, 3C-SiC-on-Si based MEMS packaged capacitive pressure sensor operating up to 500 °c and 5 MPa. in RSM 2015 - 2015 IEEE Regional Symposium on Micro and Nano Electronics, Proceedings., 7354962, Institute of Electrical and Electronics Engineers Inc., 10th IEEE Regional Symposium on Micro and Nano Electronics, RSM 2015, Kuala Terengganu, Malaysia, 19/8/15. https://doi.org/10.1109/RSM.2015.7354962
Marsi N, Yeop Majlis B, Hamzah AA, Abidin HEZ, Mohd-Yasin F. 3C-SiC-on-Si based MEMS packaged capacitive pressure sensor operating up to 500 °c and 5 MPa. In RSM 2015 - 2015 IEEE Regional Symposium on Micro and Nano Electronics, Proceedings. Institute of Electrical and Electronics Engineers Inc. 2015. 7354962 https://doi.org/10.1109/RSM.2015.7354962
Marsi, Noraini ; Yeop Majlis, Burhanuddin ; Hamzah, Azrul Azlan ; Abidin, Hafzaliza Erny Zainal ; Mohd-Yasin, Faisal. / 3C-SiC-on-Si based MEMS packaged capacitive pressure sensor operating up to 500 °c and 5 MPa. RSM 2015 - 2015 IEEE Regional Symposium on Micro and Nano Electronics, Proceedings. Institute of Electrical and Electronics Engineers Inc., 2015.
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