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Research Output 1998 2019

  • 1400 Citations
  • 13 h-Index
  • 33 Article
  • 15 Conference contribution
  • 1 Chapter
  • 1 Comment/debate
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Conference contribution
2018
1 Citation (Scopus)

Characterization of permittivity and conductivity for ESKAPE pathogens detection

Rahim, M. K. A., Buyong, M. R., Jamaludin, N. M. A., Hamzah, A. A., Siow, K. S. & Yeop Majlis, B., 3 Oct 2018, 2018 IEEE International Conference on Semiconductor Electronics, ICSE 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., Vol. 2018-August. p. 132-135 4 p. 8481278

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Pathogens
Dielectric properties
MATLAB
Permittivity
Antibiotics

Interfacial TEM Analysis of Sintered Silver in Air and N2-5%H2 Gases Environment

Siow, K. S., Chua, S. T. & Samah, Z. A., 26 Oct 2018, 2018 IEEE 38th International Electronics Manufacturing Technology Conference, IEMT 2018. Institute of Electrical and Electronics Engineers Inc., 8511681

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Silver
Gases
Transmission electron microscopy
Ointments
Air
2 Citations (Scopus)

Voltage characterization on dielectrophoretic force response to hematologic cell manipulation

Abd Samad, M. I., Buyong, M. R., Yunus, F. W., Siow, K. S., Hamzah, A. A. & Yeop Majlis, B., 3 Oct 2018, 2018 IEEE International Conference on Semiconductor Electronics, ICSE 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., Vol. 2018-August. p. 13-16 4 p. 8481286

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Blood
Electric potential
Microelectrodes
Dipole moment
Cells
2017
2 Citations (Scopus)

High-temperature Pb-free die attach material project phase 1: Survey result

Pei, L. S., Pan, B., Zhang, H., Ng, W., Wu, B., Siow, K. S., Sabne, S. & Tsuriya, M., 5 Jun 2017, 2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., p. 51-56 6 p. 7939323

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Lead
Insulated gate bipolar transistors (IGBT)
Application specific integrated circuits
Temperature
2016
1 Citation (Scopus)

Characterization of silicone gel properties for high power IGBT modules and MEMS

Siow, K. S., Chen, T. F., Chan, Y. W., Jalar @ Jalil, A., Vemal, R. M., Chua, S. T. & Husna, F., 1 Apr 2016, 2015 IEEE Conference on Sustainable Utilization and Development in Engineering and Technology, CSUDET 2015. Institute of Electrical and Electronics Engineers Inc., p. 23-27 5 p. 7446220

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Silicone Gels
Insulated gate bipolar transistors (IGBT)
Silicones
MEMS
Gels
2 Citations (Scopus)

Optimization of beam length and air gap of suspended graphene NEMS switch for low pull-in voltage application

Zulkefli, M. A., Mohamed, M. A., Siow, K. S. & Yeop Majlis, B., 21 Sep 2016, 2016 IEEE International Conference on Semiconductor Electronics, ICSE 2016 - Proceedings. Institute of Electrical and Electronics Engineers Inc., Vol. 2016-September. p. 29-32 4 p. 7573583

Research output: Chapter in Book/Report/Conference proceedingConference contribution

NEMS
Graphite
Graphene
Switches
Electric potential
1 Citation (Scopus)

Patent landscape and market segments of sintered silver as die attach materials in microelectronic packaging

Siow, K. S. & Eugenie, M., 28 Nov 2016, 2016 IEEE 37th International Electronics Manufacturing Technology, IEMT 2016 and 18th Electronics Materials and Packaging Conference, EMAP 2016. Institute of Electrical and Electronics Engineers Inc., Vol. 2016-November. 7761974

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microelectronics
Packaging
Silver
Sintering
Macros

Solid-fluid interaction in a pillar-based phononic crystal

Mohd Razip Wee, M. F., Siow, K. S., Ahmad Rifqi, M. Z., Addouche, M. & Khelif, A., 21 Sep 2016, 2016 IEEE International Conference on Semiconductor Electronics, ICSE 2016 - Proceedings. Institute of Electrical and Electronics Engineers Inc., Vol. 2016-September. p. 47-49 3 p. 7573587

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microfluidics
Crystals
Fluids
Actuators
Finite element method
1 Citation (Scopus)

TRIZ technique to produce stable plasma modified surfaces with high density of reactive chemical functionalities

Chan, Y. W., Chen, T. F., Siow, K. S., Yeop Majlis, B. & Yeoh, T. S., 1 Apr 2016, 2015 IEEE Conference on Sustainable Utilization and Development in Engineering and Technology, CSUDET 2015. Institute of Electrical and Electronics Engineers Inc., p. 11-16 6 p. 7446218

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Plasmas
Functional analysis
Materials science
Biocompatibility
Chemical properties
2015
3 Citations (Scopus)

Effect of sintering atmosphere on the shear properties of pressureless sintered silver joint

Chua, S. T., Siow, K. S. & Jalar @ Jalil, A., 12 Jun 2015, Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. Institute of Electrical and Electronics Engineers Inc., Vol. 2015-June. 7123119

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Silver
Sintering
Shear strength
Binders
Substrates
2014

Setting up an intellectual properties intermediary service: DMAIC way

Siow, K. S., 2014, IEEM 2014 - 2014 IEEE International Conference on Industrial Engineering and Engineering Management. IEEE Computer Society, Vol. 2015-January. p. 423-427 5 p. 7058673

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Intellectual property
Intermediaries
Industry
1 Citation (Scopus)

Synthesizing SnAgCu nanoparticles by electrodeposition of reverse microemulsion electrolyte

Foo, S. P., Siow, K. S. & Jalar @ Jalil, A., 10 Oct 2014, IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. Institute of Electrical and Electronics Engineers Inc., p. 513-516 4 p. 6920911

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microemulsions
Electrodeposition
Surface-Active Agents
Soldering alloys
Electrolytes
2012
4 Citations (Scopus)

Sintered silver (Ag) as lead-free die attach materials

Siow, K. S., 2012, Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. 6521795

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Silver
Lead
Testing
Microelectronics
Packaging
2006
4 Citations (Scopus)

Characterization of sulfate and phosphate containing plasma polymer surfaces

Siow, K. S., Britcher, L., Kumar, S. & Griesser, H. J., 2006, Proceedings of the 2006 International Conference on Nanoscience and Nanotechnology, ICONN. p. 302-305 4 p. 4143392

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Phosphates
Plasmas
Polymers
Plasma polymerization
Sulfur dioxide
1998

On the shear strength and mixed-mode fracture toughness of a lead-tin and a tin-silver solder

Manoharan, M., Siow, K. S. & Weiser, M. W., 1998, Materials Research Society Symposium - Proceedings. MRS, Vol. 515. p. 111-116 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Tin
Silver
Shear strength
Soldering alloys
Fracture toughness