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Research Output 1998 2019

  • 1366 Citations
  • 13 h-Index
  • 33 Article
  • 15 Conference contribution
  • 1 Chapter
  • 1 Comment/debate
2019

Finite-Elemente-Modellierung von nano-porösem gesinterten Silber unter Verwendung von Computertomographiebildern

Translated title of the contribution: Finite element modeling of nano porous sintered silver material using computed tomography imagesMeyghani, B., Awang, M., Bokam, P., Plank, B., Heinzl, C. & Siow, K. S., 1 May 2019, In : Materialwissenschaft und Werkstofftechnik. 50, 5, p. 533-538 6 p.

Research output: Contribution to journalArticle

Silver
Tomography
tomography
silver
Ointments
1 Citation (Scopus)

Influence of sintering environment on silver sintered on copper substrate

Siow, K. S., Chua, S. T., Beake, B. D. & Zuruzi, A. S., 1 Jan 2019, In : Journal of Materials Science: Materials in Electronics.

Research output: Contribution to journalArticle

Silver
Copper
sintering
Sintering
silver
Malaysia
Governance
Nanotechnology
nanotechnology
moderators
2 Citations (Scopus)

QCM-D and XPS study of protein adsorption on plasma polymers with sulfonate and phosphonate surface groups

Siow, K. S., Britcher, L., Kumar, S. & Griesser, H. J., 1 Jan 2019, In : Colloids and Surfaces B: Biointerfaces. 173, p. 447-453 7 p.

Research output: Contribution to journalArticle

Quartz Crystal Microbalance Techniques
Organophosphonates
Quartz crystal microbalances
sulfonates
quartz crystals

Spannungsanalyse von nanoporösem Material mittels Computertomographie-Aufnahmen

Translated title of the contribution: Stress analysis of nano porous material using computed tomography imagesMeyghani, B., Awang, M., Emamian, S., Plank, B., Christoph, H. & Siow, K. S., 1 Mar 2019, In : Materialwissenschaft und Werkstofftechnik. 50, 3, p. 234-239 6 p.

Research output: Contribution to journalArticle

stress analysis
porous materials
Stress analysis
Tomography
Porous materials

Thermal Cycling of Sintered Silver (Ag) Joint as Die-Attach Material

Siow, K. S. & Chua, S. T., 1 Jan 2019, In : JOM.

Research output: Contribution to journalArticle

Thermal cycling
Silver
Copper
Substrates
Pore size
2018
1 Citation (Scopus)

Characterization of permittivity and conductivity for ESKAPE pathogens detection

Rahim, M. K. A., Buyong, M. R., Jamaludin, N. M. A., Hamzah, A. A., Siow, K. S. & Yeop Majlis, B., 3 Oct 2018, 2018 IEEE International Conference on Semiconductor Electronics, ICSE 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., Vol. 2018-August. p. 132-135 4 p. 8481278

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Pathogens
Dielectric properties
MATLAB
Permittivity
Antibiotics

Interfacial TEM Analysis of Sintered Silver in Air and N2-5%H2 Gases Environment

Siow, K. S., Chua, S. T. & Samah, Z. A., 26 Oct 2018, 2018 IEEE 38th International Electronics Manufacturing Technology Conference, IEMT 2018. Institute of Electrical and Electronics Engineers Inc., 8511681

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Silver
Gases
Transmission electron microscopy
Ointments
Air
2 Citations (Scopus)
Biocompatible Materials
Biomaterials
low pressure
Siloxanes
Plasmas

Peranti Suis Nanoelektromekanikal (NEM) Berunsurkan Grafin dan Tiub Nano Karbon (CNT)

Translated title of the contribution: Nanoelectromechanical switch devices based on graphene and carbon nanotube (CNT)Zulkefli, M. A., Mohamed, M. A., Siow, K. S. & Yeop Majlis, B., 1 Mar 2018, In : Sains Malaysiana. 47, 3, p. 619-633 15 p.

Research output: Contribution to journalArticle

Graphene
Carbon nanotubes
Switches
Semiconductor switches
Fabrication
7 Citations (Scopus)

Rapid sintering of nano-Ag paste at low current to bond large area (>100 mm2) power chips for electronics packaging

Xie, Y., Wang, Y., Mei, Y., Xie, H., Zhang, K., Feng, S., Siow, K. S., Li, X. & Lu, G. Q., 1 May 2018, In : Journal of Materials Processing Technology. 255, p. 644-649 6 p.

Research output: Contribution to journalArticle

Electronics packaging
Ointments
Sintering
Heat resistance
Electric properties
2 Citations (Scopus)

Voltage characterization on dielectrophoretic force response to hematologic cell manipulation

Abd Samad, M. I., Buyong, M. R., Yunus, F. W., Siow, K. S., Hamzah, A. A. & Yeop Majlis, B., 3 Oct 2018, 2018 IEEE International Conference on Semiconductor Electronics, ICSE 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., Vol. 2018-August. p. 13-16 4 p. 8481286

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Blood
Electric potential
Microelectrodes
Dipole moment
Cells

XPS study of sulfur and phosphorus compounds with different oxidation states

Siow, K. S., Britcher, L., Kumar, S. & Griesser, H. J., 1 Aug 2018, In : Sains Malaysiana. 47, 8, p. 1913-1922 10 p.

Research output: Contribution to journalArticle

Phosphorus Compounds
Sulfur Compounds
Binding energy
X ray photoelectron spectroscopy
Oxidation
2017
6 Citations (Scopus)
Nitrogen plasma
Polyurethanes
nitrogen plasma
Methacrylates
Argon
2 Citations (Scopus)

High-temperature Pb-free die attach material project phase 1: Survey result

Pei, L. S., Pan, B., Zhang, H., Ng, W., Wu, B., Siow, K. S., Sabne, S. & Tsuriya, M., 5 Jun 2017, 2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., p. 51-56 6 p. 7939323

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Lead
Insulated gate bipolar transistors (IGBT)
Application specific integrated circuits
Temperature
2 Citations (Scopus)

Pengelupasan grafit untuk mengkomersilkan teknologi grafin

Translated title of the contribution: Graphite exfoliation to commercialize graphene technologySiow, K. S., 1 Jul 2017, In : Sains Malaysiana. 46, 7, p. 1047-1059 13 p.

Research output: Contribution to journalArticle

Graphite
Oxides
Intercalation
Feedstocks
Sensitivity analysis
2 Citations (Scopus)

Roles of palladium particles in enhancing the electrochemical migration resistance of sintered nano-silver paste as a bonding material

Wang, D., Mei, Y. H., Xie, H., Zhang, K., Siow, K. S., Li, X. & Lu, G. Q., 1 Nov 2017, In : Materials Letters. 206, p. 1-4 4 p.

Research output: Contribution to journalArticle

Adhesive pastes
Palladium
Ointments
Silver
palladium
1 Citation (Scopus)

Stress analysis of perforated graphene nano-electro-mechanical (NEM) contact switches by 3D finite element simulation

Zulkefli, M. A., Mohamed, M. A., Siow, K. S., Yeop Majlis, B., Kulothungan, J., Muruganathan, M. & Mizuta, H., 6 Jul 2017, (Accepted/In press) In : Microsystem Technologies. p. 1-9 9 p.

Research output: Contribution to journalArticle

Graphite
stress analysis
Stress analysis
Graphene
graphene
3 Citations (Scopus)

Three-dimensional finite element method simulation of perforated graphene nano-electro-mechanical (NEM) switches

Zulkefli, M. A., Mohamed, M. A., Siow, K. S., Yeop Majlis, B., Kulothungan, J., Muruganathan, M. & Mizuta, H., 31 Jul 2017, In : Micromachines. 8, 8, 236.

Research output: Contribution to journalArticle

Graphene
Switches
Finite element method
Mechanical stability
Electric potential
2016
7 Citations (Scopus)
Polyurethanes
Methacrylates
Argon
Sulfhydryl Compounds
Stoichiometry
1 Citation (Scopus)

Characterization of silicone gel properties for high power IGBT modules and MEMS

Siow, K. S., Chen, T. F., Chan, Y. W., Jalar @ Jalil, A., Vemal, R. M., Chua, S. T. & Husna, F., 1 Apr 2016, 2015 IEEE Conference on Sustainable Utilization and Development in Engineering and Technology, CSUDET 2015. Institute of Electrical and Electronics Engineers Inc., p. 23-27 5 p. 7446220

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Silicone Gels
Insulated gate bipolar transistors (IGBT)
Silicones
MEMS
Gels
1 Citation (Scopus)

Guiding and confinement of interface acoustic waves in solid-fluid pillar-based phononic crystals

Mohd Razip Wee, M. F., Addouche, M., Siow, K. S., Ahmad Rifqi, M. Z., Elayouch, A., Chollet, F. & Khelif, A., 1 Dec 2016, In : AIP Advances. 6, 12, 121703.

Research output: Contribution to journalArticle

acoustics
fluids
crystals
fluid pressure
phase velocity
33 Citations (Scopus)
Silver
Microelectronics
Packaging
Ointments
Fillers
52 Citations (Scopus)
Silver
Copper
Shear strength
Substrates
Thermal aging
2 Citations (Scopus)

Optimization of beam length and air gap of suspended graphene NEMS switch for low pull-in voltage application

Zulkefli, M. A., Mohamed, M. A., Siow, K. S. & Yeop Majlis, B., 21 Sep 2016, 2016 IEEE International Conference on Semiconductor Electronics, ICSE 2016 - Proceedings. Institute of Electrical and Electronics Engineers Inc., Vol. 2016-September. p. 29-32 4 p. 7573583

Research output: Chapter in Book/Report/Conference proceedingConference contribution

NEMS
Graphite
Graphene
Switches
Electric potential

Patent landscape and market segments of sintered silver as die attach materials in microelectronic packaging

Siow, K. S. & Eugenie, M., 28 Nov 2016, 2016 IEEE 37th International Electronics Manufacturing Technology, IEMT 2016 and 18th Electronics Materials and Packaging Conference, EMAP 2016. Institute of Electrical and Electronics Engineers Inc., Vol. 2016-November. 7761974

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microelectronics
Packaging
Silver
Sintering
Macros
10 Citations (Scopus)

Plasma polymerized carvone as an antibacterial and biocompatible coating

Chan, Y. W., Siow, K. S., Ng, P. Y., Usup, G. & Yeop Majlis, B., 1 Nov 2016, In : Materials Science and Engineering C. 68, p. 861-871 11 p.

Research output: Contribution to journalArticle

bacteria
Bacteria
Plasmas
coatings
Assays
1 Citation (Scopus)

Plasma Polymers Containing Sulfur and Their Co-Polymers With 1,7-Octadiene: Chemical and Structural Analysis

Siow, K. S., Britcher, L., Kumar, S. & Griesser, H. J., 2016, (Accepted/In press) In : Plasma Processes and Polymers.

Research output: Contribution to journalArticle

chemical analysis
Sulfur
structural analysis
Structural analysis
Polymers

Solid-fluid interaction in a pillar-based phononic crystal

Mohd Razip Wee, M. F., Siow, K. S., Ahmad Rifqi, M. Z., Addouche, M. & Khelif, A., 21 Sep 2016, 2016 IEEE International Conference on Semiconductor Electronics, ICSE 2016 - Proceedings. Institute of Electrical and Electronics Engineers Inc., Vol. 2016-September. p. 47-49 3 p. 7573587

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microfluidics
Crystals
Fluids
Actuators
Finite element method
1 Citation (Scopus)

TRIZ technique to produce stable plasma modified surfaces with high density of reactive chemical functionalities

Chan, Y. W., Chen, T. F., Siow, K. S., Yeop Majlis, B. & Yeoh, T. S., 1 Apr 2016, 2015 IEEE Conference on Sustainable Utilization and Development in Engineering and Technology, CSUDET 2015. Institute of Electrical and Electronics Engineers Inc., p. 11-16 6 p. 7446218

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Plasmas
Functional analysis
Materials science
Biocompatibility
Chemical properties
2015
3 Citations (Scopus)

Effect of sintering atmosphere on the shear properties of pressureless sintered silver joint

Chua, S. T., Siow, K. S. & Jalar @ Jalil, A., 12 Jun 2015, Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. Institute of Electrical and Electronics Engineers Inc., Vol. 2015-June. 7123119

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Silver
Sintering
Shear strength
Binders
Substrates
15 Citations (Scopus)

Electrical conductivity of porous silver made from sintered nanoparticles

Zuruzi, A. S. & Siow, K. S., 1 Mar 2015, In : Electronic Materials Letters. 11, 2, p. 308-314 7 p.

Research output: Contribution to journalArticle

Ligaments
Silver
Nanoparticles
Annealing
Electric Conductivity
31 Citations (Scopus)

Low-pressure plasma methods for generating non-reactive hydrophilic and hydrogel-like bio-interface coatings - A review

Siow, K. S., Kumar, S. & Griesser, H. J., 1 Jan 2015, In : Plasma Processes and Polymers. 12, 1, p. 8-24 17 p.

Research output: Contribution to journalArticle

Hydrogel
Hydrogels
low pressure
Plasmas
coatings
2014
132 Citations (Scopus)
Ointments
Silver
packaging
microelectronics
Microelectronics
17 Citations (Scopus)

Deposition and XPS and FTIR analysis of plasma polymer coatings containing phosphorus

Siow, K. S., Britcher, L., Kumar, S. & Griesser, H. J., Feb 2014, In : Plasma Processes and Polymers. 11, 2, p. 133-141 9 p.

Research output: Contribution to journalArticle

Phosphorus
phosphorus
Phosphites
phosphates
Polymers

Setting up an intellectual properties intermediary service: DMAIC way

Siow, K. S., 2014, IEEM 2014 - 2014 IEEE International Conference on Industrial Engineering and Engineering Management. IEEE Computer Society, Vol. 2015-January. p. 423-427 5 p. 7058673

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Intellectual property
Intermediaries
Industry
1 Citation (Scopus)

Synthesizing SnAgCu nanoparticles by electrodeposition of reverse microemulsion electrolyte

Foo, S. P., Siow, K. S. & Jalar @ Jalil, A., 10 Oct 2014, IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. Institute of Electrical and Electronics Engineers Inc., p. 513-516 4 p. 6920911

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microemulsions
Electrodeposition
Surface-Active Agents
Soldering alloys
Electrolytes
2012
204 Citations (Scopus)

Mechanical properties of nano-silver joints as die attach materials

Siow, K. S., 15 Feb 2012, In : Journal of Alloys and Compounds. 514, p. 6-19 14 p.

Research output: Contribution to journalArticle

Ointments
Silver
Mechanical properties
Thermal fatigue
Processing
4 Citations (Scopus)

Sintered silver (Ag) as lead-free die attach materials

Siow, K. S., 2012, Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. 6521795

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Silver
Lead
Testing
Microelectronics
Packaging
2009
33 Citations (Scopus)

Sulfonated surfaces by sulfur dioxide plasma surface treatment of plasma polymer films

Siow, K. S., Britcher, L., Kumar, S. & Griesser, H. J., 15 Sep 2009, In : Plasma Processes and Polymers. 6, 9, p. 583-592 10 p.

Research output: Contribution to journalArticle

Sulfur Dioxide
sulfur dioxides
Sulfur dioxide
surface treatment
Polymer films
2006
4 Citations (Scopus)

Characterization of sulfate and phosphate containing plasma polymer surfaces

Siow, K. S., Britcher, L., Kumar, S. & Griesser, H. J., 2006, Proceedings of the 2006 International Conference on Nanoscience and Nanotechnology, ICONN. p. 302-305 4 p. 4143392

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Phosphates
Plasmas
Polymers
Plasma polymerization
Sulfur dioxide
672 Citations (Scopus)

Plasma methods for the generation of chemically reactive surfaces for biomolecule immobilization and cell colonization - A review

Siow, K. S., Britcher, L., Kumar, S. & Griesser, H. J., 15 Aug 2006, In : Plasma Processes and Polymers. 3, 6-7, p. 392-418 27 p.

Research output: Contribution to journalArticle

Biomolecules
immobilization
Plasmas
cells
Polymers
2005
1 Citation (Scopus)

A study on microstructural and mechanical properties of nanocrystalline nickel

Mohankumar, K., Siow, K. S., Jayaganthan, R., Tay, A. A. O. & Kripesh, V., Aug 2005, In : International Journal of Nanoscience. 4, 4, p. 615-622 8 p.

Research output: Contribution to journalArticle

Electroplating
Hardness
Nickel
Electrodeposition
electrodeposition
16 Citations (Scopus)

Mixed mode fracture toughness of lead-tin and tin-silver solder joints with nickel-plated substrate

Siow, K. S. & Manoharan, M., 15 Sep 2005, In : Materials Science and Engineering A. 404, 1-2, p. 244-250 7 p.

Research output: Contribution to journalArticle

Tin
solders
Nickel
fracture strength
Silver
2004
56 Citations (Scopus)

Mechanical properties of nanocrystalline copper and nickel

Siow, K. S., Tay, A. A. O. & Oruganti, P., Mar 2004, In : Materials Science and Technology. 20, 3, p. 285-294 10 p.

Research output: Contribution to journalArticle

Nickel
Copper
nickel
mechanical properties
Nanocrystalline materials
2001
13 Citations (Scopus)

Correlation between intermetallic thickness and roughness during solder reflow

Zuruzi, A. S., Lahiri, S. K., Burman, P. & Siow, K. S., Aug 2001, In : Journal of Electronic Materials. 30, 8, p. 997-1000 4 p.

Research output: Contribution to journalArticle

solders
Soldering alloys
Intermetallics
intermetallics
roughness
20 Citations (Scopus)

Pitting corrosion of duplex stainless steels

Siow, K. S., Song, T. Y. & Qiu, J. H., 2001, In : Anti-Corrosion Methods and Materials. 48, 1, p. 31-36 6 p.

Research output: Contribution to journalArticle

Stainless Steel
Pitting
Stainless steel
Corrosion
Austenite
1999
1 Citation (Scopus)

Fracture of a lead-tin and a tin-silver solder under combined tensile shear loading

Manoharan, M. & Siow, K. S., 1999, Materials Research Society Symposium - Proceedings. Vol. 563. p. 15-20 6 p.

Research output: Chapter in Book/Report/Conference proceedingChapter

Tin
Silver
Soldering alloys
Lead
Shear strength
1998

On the shear strength and mixed-mode fracture toughness of a lead-tin and a tin-silver solder

Manoharan, M., Siow, K. S. & Weiser, M. W., 1998, Materials Research Society Symposium - Proceedings. MRS, Vol. 515. p. 111-116 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Tin
Silver
Shear strength
Soldering alloys
Fracture toughness