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Fingerprint Dive into the research topics where Azman Jalar @ Jalil is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

  • 6 Similar Profiles
Soldering alloys Engineering & Materials Science
Nanoindentation Engineering & Materials Science
solders Physics & Astronomy
Gold Engineering & Materials Science
Wire Engineering & Materials Science
Hardness Engineering & Materials Science
Microstructure Engineering & Materials Science
Soldering Engineering & Materials Science

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Research Output 2004 2019

  • 660 Citations
  • 13 h-Index
  • 110 Conference contribution
  • 105 Article
  • 3 Conference article
1 Citation (Scopus)

Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition

Wan Yusoff, W. Y., Ismail, N., Safee, N. S., Ismail, A., Jalar @ Jalil, A. & Abu Bakar, M., 1 Apr 2019, In : Soldering and Surface Mount Technology. 31, 2, p. 102-108 7 p.

Research output: Contribution to journalArticle

Microstructural evolution
blasts
solders
hardness
Soldering alloys
Gold
Wire
Failure modes
Temperature

Effect of different S AC based nanoparticles types on the reflow soldering process of miniaturized component using discrete phase model simulation

Mukhtar, M. A. F. M., Abas, A., Haslinda, M. S., Che Ani, F., Jalar @ Jalil, A., Saad, A. A., Abdullah, M. Z. & Ismail, R., 1 Jan 2019, In : Journal of Applied Fluid Mechanics. 12, 5, p. 1683-1696 14 p.

Research output: Contribution to journalArticle

Open Access
soldering
Soldering
alternating current
Nanoparticles
nanoparticles

Effect of surface roughness and hardness of leadframe on the bondability of gold wedge bonds

Zulkifli, M. N., Harun, F. & Jalar @ Jalil, A., 1 Jan 2019, In : Microelectronics International.

Research output: Contribution to journalArticle

Gold
wedges
surface roughness
hardness
ultrasonics

Kesan gelombang kejutan terhadap sifat mikromekanik sambungan pateri SAC 0307/ENiG menggunakan pendekatan pelekukan nano

Translated title of the contribution: Effect of shock wave on micromechanical properties of SAC 0307/ENiG Solder joint using nanoindentation approachBakar, M. A., Jalar @ Jalil, A., Wan Yusoff, W. Y., Safee, N. S., Ismail, A., Ismail, N., Salleh, E. M. & Ibrahim, N. S., 1 Jan 2019, In : Sains Malaysiana. 48, 6, p. 1273-1279 7 p.

Research output: Contribution to journalArticle

Open Access
Nanoindentation
Shock waves
Soldering alloys
Electronics packaging
Hardness