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Fingerprint Dive into the research topics where Azman Jalar @ Jalil is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

  • 6 Similar Profiles
Soldering alloys Engineering & Materials Science
Nanoindentation Engineering & Materials Science
solders Physics & Astronomy
Gold Engineering & Materials Science
Wire Engineering & Materials Science
Hardness Engineering & Materials Science
Microstructure Engineering & Materials Science
Soldering Engineering & Materials Science

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Research Output 2004 2019

  • 678 Citations
  • 13 h-Index
  • 110 Conference contribution
  • 106 Article
  • 3 Conference article
1 Citation (Scopus)

Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition

Wan Yusoff, W. Y., Ismail, N., Safee, N. S., Ismail, A., Jalar @ Jalil, A. & Abu Bakar, M., 1 Apr 2019, In : Soldering and Surface Mount Technology. 31, 2, p. 102-108 7 p.

Research output: Contribution to journalArticle

Microstructural evolution
Soldering alloys
Failure modes

Effect of different S AC based nanoparticles types on the reflow soldering process of miniaturized component using discrete phase model simulation

Mukhtar, M. A. F. M., Abas, A., Haslinda, M. S., Che Ani, F., Jalar @ Jalil, A., Saad, A. A., Abdullah, M. Z. & Ismail, R., 1 Jan 2019, In : Journal of Applied Fluid Mechanics. 12, 5, p. 1683-1696 14 p.

Research output: Contribution to journalArticle

Open Access
alternating current

Effect of surface roughness and hardness of leadframe on the bondability of gold wedge bonds

Zulkifli, M. N., Harun, F. & Jalar @ Jalil, A., 1 Jan 2019, In : Microelectronics International.

Research output: Contribution to journalArticle

surface roughness

Kesan gelombang kejutan terhadap sifat mikromekanik sambungan pateri SAC 0307/ENiG menggunakan pendekatan pelekukan nano

Translated title of the contribution: Effect of shock wave on micromechanical properties of SAC 0307/ENiG Solder joint using nanoindentation approachBakar, M. A., Jalar @ Jalil, A., Wan Yusoff, W. Y., Safee, N. S., Ismail, A., Ismail, N., Salleh, E. M. & Ibrahim, N. S., 1 Jan 2019, In : Sains Malaysiana. 48, 6, p. 1273-1279 7 p.

Research output: Contribution to journalArticle

Open Access
Shock waves
Soldering alloys
Electronics packaging